Crossing Automation - Trans-Center Shuttle-Lock
The Trans-Center/Shuttle-Lock (TC/SL) sub-system is an interesting and distinctive part of the ExpressConnect™ vacuum product family. The pairing of the TC/SL delivers a backbone that can be applied to both conventional cluster single wafer tools, as well as to some small batch reactor designs.
The TC/SL backbone offers a number of unique attributes. One is enhanced vacuum isolation between process modules. Another is improved process module utilization due to Shuttle-Lock distributed motion design.
Although not appropriate for all wafer transfer applications, the TC/SL can provide significant benefits to some advanced process integration challenges, such as multi-step and high temperature processes.