Crossing Automation - ExpressConnect™ Sub-Systems
Crossing Automation delivers ExpressConnect's modular components in a number of basic sub-system configurations that serve as the standard foundation for tool-level wafer automation, providing the vacuum transfer system and its management. This allows equipment manufacturers to develop proprietary configurations to achieve a market advantage while retaining full control over the upstream and downstream parameters within their own process tool.
Available sub-systems include:
Shuttle-Lock
A standalone Shuttle-Lock(SL) to fulfill applications from process development to operation as a module in an inline system.
Shuttle-Lock/Load Lock
Since the Shuttle-Lock/Load Lock(SL/LL) may come as a 2, 3 or 4 sided device, the SL/LL is an ideal, compact, low-cost platform for applications ranging from non-critical process steps to highly complex process solutions.
Shuttle-Lock/Multi Wafer Buffer
The Shuttle-Lock/Multi Wafer Buffer(SL/MWB) offers a solution to the typical in-line system where a bottleneck is created when robots are placed in-line at all points along the backbone. The four sided MWB allows a clear path at those crossing points and thus, relieves the bottlenecks.
Shuttle-Lock/Trans-Center
The Shuttle-Lock/Trans-Center(TC/SL) offers a unique tool design for high temperature process steps where cool down steps may impact throughput.